Programme IPSR-I 2023
PIC Summit Europe 2023
Application guide presentations: Agrifood, Healthcare, Quantum and Aerospace
Experts in the topics Agrifood, Healthcare, Quantum and Aerospace present the roadmaps for PICs in these application fields. Please provide your feedback using Mentimeter.
Technology chapter presentations: Packaging, SOI, SiN, InP&III-V and Polymers
Experts in the topics Packaging, the Silicon on Insulator material platform, the Silicon Nitride platform, Indium Phosphide and III-V materials and polymers for photonics present the roadmaps for PICs in their respective fields. Please provide your feedback using Mentimeter.
Networking break
Application guide presentations: Datacom and Automotive followed by panel Q&A (virtual)
Experts in the topics Datcom and Automotive present the roadmaps for PICs in these application fields. We end the session with a panel Q&A with all the application guide working group leaders in the topics Agrifood, Healthcare, Quantum, Aerospace, Datacom and Automotive. Please provide your feedback using Mentimeter.
Technology chapter presentations: Assembly, Testing and EPDA
Experts in the topics Assembly, Testing and Electronic-Photonic Design Automation present the roadmaps for PICs in their respective fields. Please provide your feedback using Mentimeter.
Technology in-depth discussion session 1a: Packaging, Assembly, Test and EPDA crossover
Working group leaders for the topics Assembly, Packaging, Testing and Electronic-Photonic Design Automation guide an open-floor discussion session on the alignment of their respective roadmaps. What can each link in the supply chain offer for the others? What do they require from the others? Which misalignments exist between their respective roadmaps which must be addressed to accommodate high volume and high quality PIC production in the future?
Technology in-depth discussion session 1b: SOI, SiN, InP&III-V and Polymers crossover
Working group leaders for the topics Silicon on Insulator material platform, Silicon Nitride platform, InP&III-V materials and Polymers for photonics guide an open-floor discussion session on the alignment of their respective roadmaps. What can each link in the supply chain offer for the others? What do they require from the others? Which misalignments exist between their respective roadmaps which must be addressed to accommodate high volume and high quality PIC production in the future?
Networking Drinks & Dinner
Dinner only for IPSR-I attendants
Welcome & Registration
Kick-off
Technology in-depth discussion session 2a: InP&III-V, Polymers, Test and EPDA crossover
Working group leaders for the topics InP&III-V materials, Polymers for photonics, Testing and Electronic-Photonic Design Automation guide an open-floor discussion session on the alignment of their respective roadmaps. What can each link in the supply chain offer for the others? What do lucjurgemust be addressed to accommodate high volume and high quality PIC production in the future?
Technology in-depth discussion session 2b: SOI, SiN, Packaging and Assembly cross-over
Working group leaders for the topics Silicon on Insulator material platform, Silicon Nitride platform, Packaging and Assembly guide an open-floor discussion session on the alignment of their respective roadmaps. What can each link in the supply chain offer for the others? What do they require from the others? Which misalignments exist between their respective roadmaps which must be addressed to accommodate high volume and high quality PIC production in the future?
Networking break
Technology in-depth discussion session 3a: InP&III-V, Polymers, Packaging and Assembly cross-over
Working group leaders for the topics InP&III-V materials, Polymers for photonics, Packaging and Assembly guide an open-floor discussion session on the alignment of their respective roadmaps. What can each link in the supply chain offer for the others? What do they require from the others? Which misalignments exist between their respective roadmaps which must be addressed to accommodate high volume and high quality PIC production in the future?
Technology in-depth discussion session 3b: SOI, SiN, Testing and EPDA cross-over
Working group leaders for the topics Silicon on Insulator material platform, Silicon Nitride platform, Testing and Electronic-Photonic Design Automation guide an open-floor discussion session on the alignment of their respective roadmaps. What can each link in the supply chain offer for the others? What do they require from the others? Which misalignments exist between their respective roadmaps which must be addressed to accommodate high volume and high quality PIC production in the future?
Networking lunch
Theme discussion a: Heterogeneous integration
Guided open floor discussion on the challenges and solutions for heterogeneous integration. Heterogeneous integration is defined by the IPSR-I as “integrating multiple technical functions in a single chip made in mass on wafer level, out of two or more substrate technologies using wafer bonding or un- or partially-processed die attachment”.
Theme discussion b: Alignment of equipment for high volume PIC production
Guided open floor discussion on the alignment of equipment for high volume PIC production. How can we coordinate the development of new equipment in an optimal way and what will be the challenges, possible solutions and probable timelines?
Theme discussion c: Sustainability in PIC production
Guided open floor discussion on improving sustainability in PIC production.
Theme discussion d: Human capital
Guided open floor discussion on the challenges for workforce development for the PIC industry.
Networking break
Panel discussion with all the IPSR-I application and technology working group leaders
Panel discussion with all working group leaders from the IPSR-I technology chapters and application guides. Feel free to ask your questions using Mentimeter.
Plenary closing of the IPSR-I program
Plenary closing of the program by the IPSR-I board.
Networking & Drinks
