Presentations

 

Welcome & Introduction Host & CEO

Introduction and insightful interview led by the host Irene, alongside Eelko Brinkhoff, CEO of PhotonDelta. Together, they set the stage with a comprehensive market overview, exploring the critical importance of scaling and the key strategies behind successful growth.

  • Pasfoto Irene Rompa
    Irene Rompa
    Host PIC Summit Europe
    (De Foundary)
  • Pasfoto Eelko Brinkhoff
    Eelko Brinkhoff
    CEO
    (PhotonDelta)
 

Keynote: Public-Private Collaboration in Integrated Photonics

This keynote delves into the vital role of government in shaping the integrated photonics industry, focusing on policy, public-private collaboration, and driving innovation at scale.

  • Pasfoto Gustav Kalbe
    Gustav Kalbe
    Acting Director in DG Communications Networks, Content and Technology
    (European Commission)
 

Keynote: Innovations in the semiconductor industry to continue scaling and meet AI demand

This talk addresses developments shaping the semiconductor industry in addressing global demand for AI and data. The growing convergence of photonics and electronics, especially in high-performance applications, determines the requirements for photonics and its production techniques. ASML will share a holistic litho perspective covering scanners, Optical Proximity Correction (OPC) and e-beam metrology. 

  • Pasfoto Anne Hidma
    Anne Hidma
    Senior Vice President EUR & US
    (ASML Executive Team)
 

Keynote: Next-Gen Tech Drives Semiconductor Expansion

Advanced technologies and innovation are driving the ongoing expansion of the semiconductor industry, which is set for robust growth in 2025 and beyond. Key trends include rising demand in AI, data center, automotive, and IoT, with significant investments in advanced manufacturing, packaging, and materials advancing performance, efficiency, and integration. Chipmakers are increasing capital expenditures to expand capacity and address surging needs in logic, memory, and high-bandwidth connectivity, spurred by generative AI and next-generation compute architectures.

Solutions built on advanced process nodes such as 7nm, 5nm, 3nm, and beyond along with silicon photonics, COUPE (COmpact Universal Photonics Engine), co-packaged optics, breakthroughs in 3D stacking and new materials form essential building blocks for next-generation applications at TSMC. By strategically combining diverse innovations and investing in scalable foundry platforms, TSMC is setting the stage for the next wave of semiconductor industry growth and driving transformative advances in global digital infrastructure.

  • Pasfoto Wenchi Chang
    Wenchi Chang
    Senior Technical Manager
    (TSMC)
 

Keynote: A Success Story of PIC Applications

Expanding the application space of terrestrial wireless optical communications with photonic integrated circuits

  • Pasfoto Devin Brinkley
    Devin Brinkley
    SVP & Engineering Lead
    (Taara)
 

Keynote: PIXEurope - From Pilotline to Factory

This keynote will present the newly launched Chips JU Pilot Line on Advanced Photonic Integrated Circuits. PIXEurope will develop cutting-edge technological platforms, transfer them to the European industry and provide open access for accelerating the introduction of products to the market.

  • Pasfoto Valerio Pruneri
    Valerio Pruneri
    ICFO & ICREA
    (Director PIXEurope)
 

Keynote: Recent Progress of CPO for AI Data Center in Taiwan

As AI technology surges, Taiwan’s data centers face soaring demand for high-speed signal transmission, pushing beyond the limits of electrical methods and toward optical solutions. Taiwan excels in silicon photonics and nanophotonics, utilizing Photonic Integrated Circuits (PIC) for miniaturization and high integration to advance Co-Packaged Optics (CPO) for AI data centers. From device simulation to chip packaging and validation, Taiwan has established a complete in-house workflow. By adopting thin-film lithium niobate (TFLN) and organic materials for silicon-organic hybrid (SOH) modulators, the target is per-lane 200Gbps and beyond. Recent chip tests show PAM4 TDECQ around 1.6dB, indicating strong performance. Collaborative efforts include integrating nanophotonics into silicon platforms and developing WDM technology with self-designed DFB lasers for 3.2T throughput. Highlights feature monolithic meta surface integration on photonic crystal lasers for spatial sensing and optical communications, supported by numerous papers and patents, underscoring Taiwan’s leadership in global CPO advancements.

  • Pasfoto Dr. Hao-Chung Kuo
    Dr. Hao-Chung Kuo
    Director Semiconductor Research Centre
    (Hon Hai Research Institute)
 

Keynote: Challenges of supporting dynamic Photonic IC market for foundries

The ultimate goal of lowering complexity, cost and power consumption leads to multiple integration schemes for Photonic Integrated Circuits.  Tower’s challenge is providing flexibility for individual companies to differentiate while providing a robust manufacturing environment.  We explore our vision of market directions and technology required to support innovative solutions. 

  • Pasfoto Todd Mahlen
    Todd Mahlen
    CMO & VP of Sales
    (Tower Semiconductor)
 

Keynote: Advanced Integrated Photonics Packaging

The demand for higher performance, lower power consumption, miniaturization and low latency data transmission is driving the need for advanced integrated photonics packaging. This talk explores the multifaceted challenges and opportunities in pushing the boundaries of integration density.  Equally critical is the transformation of the equipment ecosystem required to support these advancements. This talk will highlight the enabling tools and infrastructure necessary to maintain yield, reliability, and cost effectiveness at scale.

  • Pasfoto Azmina Somani
    Azmina Somani
    Vice President, R&D
    (Jabil)
 

Keynote: Bottlenecks in development of reliable integrated graphene photonics platform

Photonic interconnects are gaining significant traction in AI computing because they address several critical bottlenecks that electronic interconnects struggle with at the massive scales required for modern AI workloads. Major AI companies are driving adoption because their training clusters and inference systems have reached scales where the advantages of photonics clearly outweigh the costs. The economics make sense when you're building systems with tens of thousands of GPUs that need to communicate efficiently. SiPh is the “State Of The Art” for mass produced photonics, but SiPh is incompatible with BEOL (back end of line) integration, reason is temperature budget, process compatibility and availability of materials. Integrated Graphene photonics allows high speed and high efficiency modulators and detectors and is one of the only material system that has the temperature budget, devices, and compatibility to allow BEOL integration. It allows to bring photonics on every chip and fundamentally rethink computer system architectures. Nonetheless, Graphene is not available in any semiconductor foundry ecosystem and has only been explored in Lab environments. In this talk we tell the journey of Black Semiconductor to close this gap.

  • Pasfoto Cedric Huyghebaert
    Cedric Huyghebaert
    CTO
    (Black Semiconductor)
 

Applied Materials Photonics Platform: Catalyzing Photonics for AR

In this presentation, we will discuss how Applied Materials’s Photonics Platform is scaling various photonic applications from lab to HVM scale. The main focus will be on our efforts in Augmented Reality and how we see this product and our role in it scaling to true High Volume Manufacturing, leveraging Applied Materials’s experience.

  • Pasfoto Rutger Thijssen
    Rutger Thijssen
    Director
    (Applied Materials)
 

The sweetspot for photonic IC manufacturing standardization

This panel discussion will explore how standardization can help scale the integrated photonics industry while maintaining opportunities for innovation.

  • Pasfoto Thomas Hessler
    Thomas Hessler
    CEO
    (Ligentec)
  • Pasfoto Ivan Nikitski
    Ivan Nikitski
    Technology Expert
    (EPIC)
  • Pasfoto Michiel Boermans
    Michiel Boermans
    Sr. Product Marketing Manager
    (SMART Photonics)
  • Pasfoto Sander Roosendaal
    Sander Roosendaal
    Senior R&D Leader
    (Synopsys)
 

Keynote: Shaping the Future of the Photonics Industry with Sustainable Innovation

The plenary closing keynote explores imec’s crucial role in accelerating and scaling integrated photonics technologies, showing how sustainable innovation and strong ecosystem collaboration are driving the industry forward.

  • Pasfoto Patrick Vandenameele
    Patrick Vandenameele
    Executive Vice President & CEO-elect
    (imec)
 

Keynote: Celebrate innovation: PhotonDelta Innovation Award

Perceptra, a US-based startup, winner of the PhotonDelta Global Photonics Engineering Contest, earning funding in services to accelerate the development of the first ultra-compact, PIC-based Raman analyser - 1,000x smaller and 100x more affordable than current systems. Their groundbreaking technology enables real-time molecular sensing for bio-manufacturing, solving inefficiencies in R&D and production that currently delay life-saving innovations.

  • Pasfoto Amir Atabaki
    Amir Atabaki
    Co-Founder and CEO
    (Perceptra Technologies)
 

Fireside chat: PICs through-out multiple application area's (Flexibility vs Cost)

This fireside chat explores how the versatility of PIC technologies can shape the industry’s future, particularly given its high-mix, high-value nature. Beyond datacom, where volumes are still more varied than in semiconductors, the discussion will focus on strategies to optimize for this reality while highlighting the key opportunities and threats that come with these dynamics.

  • Pasfoto Joost van Kerkhof
    Joost van Kerkhof
    COO & Co-founder
    (PHIX)
  • Pasfoto Iñigo Artundo
    Iñigo Artundo
    CEO
    (VLC Photonics)
  • Pasfoto Pieter Dumon
    Pieter Dumon
    CEO & Co-founder
    (Luceda Photonics)
 

Keynote: Market opportunities for PICs: from interconnects to sensors

Photonic integrated circuits (PICs) are key elements in optical interconnects wiring AI Clusters. These PICs are getting faster and more complex. Some of them are being integrated with switching ASICs and XPUs. This is a great market, but if there more to expect from confluence in development of more sophisticated PICs and new Ai applications? Optical sensors powered by AI may be the next opportunity for PIC suppliers. Such sensors have to be designed with “AI in mind” to take full advantage of it. Sensor data does not have to make sense to a human, as long as an AI model can be trained to interpret the data. A process of co-designing PIC sensors and AI models for them is reminiscent to natural evolution of living organisms, except it is all done in silicon.

  • Pasfoto Vladimir Kozlov
    Vladimir Kozlov
    CEO
    (LightCounting)
 

Keynote: Lasers On-PIC or Off-PIC? The Billion-Dollar Question for CPO

This presentation addresses the critical question of whether lasers should be placed on-PIC or off-PIC in the context of Co-Packaged Optics (CPO) architectures. While off-PIC solutions are currently favored for near-term deployment, many companies are pursuing highly integrated on-PIC photonic solutions. I will analyze both approaches with a focus on yield, power consumption, and, most critically, reliability. A key question is whether the cumulative MTBF contribution of all optical links based on modern electro-optical assemblies can align with the ~1,000,000-hour MTBF typically expected from high-quality switch motherboards . Finally, I will highlight how Quantum Dot (QD) lasers, with their inherent reliability, manufacturability and ease of integration, could shift the paradigm toward fully integrated solutions for scalable datacom and AI systems.

  • Pasfoto Alexey Kovsh
    Alexey Kovsh
    Co-founder
    (Innolume GmbH)
 

Keynote: Spectral Sensing for Health and Agrifood Insight

MantiSpectra envisions a world where material analysis and health insights are available anytime, anywhere, empowering a healthier and smarter life. In this talk, we present how MantiSpectra’s miniaturized spectral sensing products enable accessible and scalable material analysis for real-world applications. By capturing and interpreting light at the molecular level, our sensors provide real-time monitoring of food quality, raw ingredients, and human health indicators. Compact, affordable, and easy to integrate, they deliver fast and reliable insights directly where decisions are made, from production lines to consumer devices and wearables. This presentation highlights how MantiSpectra’s scalable spectral sensing platform transforms advanced photonics into practical solutions for healthcare and agrifood, shaping a more sustainable and informed future through the power of light.

  • Pasfoto Kaylee Hakkel
    Kaylee Hakkel
    COO
    (MantiSpectra)
 

Keynote: Bringing the Lab Home

Today, billions of hours are wasted annually on blood draws, lab visits, and delayed results. These are barriers that keep preventative healthcare out of reach for many. SiPhox Health is pioneering a new category of at-home diagnostics by integrating silicon photonics, microfluidics, and advanced biochemistry into a compact reader the size of a coffee maker.

  • Pasfoto Diedrik Vermeulen
    Diedrik Vermeulen
    Co-founder & CEO
    (SiPhox Health)
 

Keynote: Photonics in Agriculture: Lely’s Vision for Smarter, Sustainable Farming

This presentation explores Lely’s pioneering role in agricultural automation and its strategic vision for integrating photonics technology into dairy farming. It highlights how photonic sensors can revolutionize precision agriculture by enabling real-time monitoring of for instance ammonia, soil health, milk quality, and feed efficiency. The presentation outlines key farmer requirements for sensor robustness, affordability, and system integration, and emphasizes the importance of deeptech partnerships and ecosystem development. 

  • Pasfoto Martijn Boelens
    Martijn Boelens
    CTO
    (Lely)
 

Keynote: Integrated optics in the age of artificial intelligence

Artificial Intelligence is changing the way we live faster than any technology that came before it. In this talk we’ll dive into the compute infrastructure on which this revolution is built. We’ll review how unprecedented scaling is at the core of the ever-growing capabilities of our AI companions and how photonic integrated circuits may be one of the key technologies necessary to enable continued growth. More specifically we’ll take a look at where optics is used in today’s AI factories and how it will penetrate deeper and deeper into the networking fabric. 

  • Pasfoto Yannick de Koninck
    Yannick de Koninck
    Senior Engineer
    (NVIDIA)
 

Keynote: Integrated Photonics for Quantum Technology in Space

Quantum communication and quantum technologies are rapidly advancing toward operational deployment, with space platforms playing a key role in enabling global-scale quantum networks and secure infrastructures. A central enabler in this roadmap is integrated photonics. In this talk, we highlight the impact of photonic integrated chips on quantum technology development by showcasing the design, testing, and qualification approaches for a space-ready Quantum Random Number Generator (QRNG) based on a photonic integrated circuit. We will conclude by presenting the outlook and key requirements for integrated photonics to meet the quality and reliability standards for space applications, paving the way for higher maturity and broader adoption.

  • Pasfoto Matteo Rossetto
    Matteo Rossetto
    Space Systems Engineer
    (OHB System AG)
 

Keynote: LiDAR-on-a-Chip: The Path to Mass-Market 3D Sensing

LiDAR is an essential perception technology for autonomous systems, from passenger cars to long-haul trucking. Achieving the required levels of safety and availability is not possible with vision-based systems alone. For LiDAR to achieve widespread adoption, however, it must follow the path of cameras and radar: silicon-level integration. Voyant Photonics is leading this transition, developing scalable LiDAR-on-a-chip solutions to unlock a new generation of applications in mobility and beyond.

  • Pasfoto Chris Phare
    Chris Phare
    CSO
    (Voyant Photonics)
 

Keynote: PICs: a change of paradigm for functions and systems in Thales

Advances in Photonic Integrated Circuit (PIC) technology support the expanding use of photonics and optoelectronics, enabling new possibilities for compact photonic-based military capabilities. Their potential application in military equipment offers innovative engineering approaches to integrated optoelectronic sensors and communication systems, reducing size, weight, and power consumption. Applications of PIC technology in military systems include the future development of optical communications, coherent sensors, integrated RF photonic systems, and positioning, navigation, and timing (PNT).

  • Pasfoto Jérôme Bourderionnet
    Jérôme Bourderionnet
    Optical Scientist
    (Thales Research & Technology)
 

Roadmap

  • Pasfoto Peter van Arkel
    Peter van Arkel
    CTO
    (PhotonDelta)
 

Official closing of PIC Summit Europe 2025

  • Pasfoto Irene Rompa
    Irene Rompa
    Host PIC Summit Europe
    (De Foundary)
  • Pasfoto Eelko Brinkhoff
    Eelko Brinkhoff
    CEO
    (PhotonDelta)
 

Keynote: Large-scale integrated photonics for next-generation AI infrastructure

As artificial intelligence scales toward ever-larger models and clusters, the underlying infrastructure faces critical bandwidth, cost and energy bottlenecks. Photonic integrated circuits (PICs) provide a transformative solution, enabling fast, efficient data movement and processing by harnessing light. Tracing two decades of photonic evolution, we identify scalability laws driving exponential growth in actuator counts, projected to surpass 10⁵ within six years. This talk explores how advances in photonics, tightly coupled with electronics and software, are unlocking the next generations of AI hardware. We emphasize ecosystem maturity and highlight how large-scale integrated optics are reshaping cluster architectures for AI at scale.

  • Pasfoto Ana González
    Ana González
    Vice President
    (iPRONICS)
 

Taiwan Eco-system Networking Session

 

A new initiative for building deeptech startups

  • Pasfoto Laurens Weers
    Laurens Weers
    CFO
    (PhotonDelta)
  • Pasfoto Stephan Botz
    Stephan Botz
    Co-Founder
    (Gritd)
 

Breaking the Bottleneck: High-Volume Manufacturing of TFLN PICs for Telecom & Datacom

As demand for AI, cloud computing, and data-intensive applications are increasing exponentially, the demand for faster, more efficient data optical interconnects skyrockets. Traditional silicon or III-V semiconductor-based transceivers are hitting an upper physical limit, creating critical bottlenecks in telecom and datacom infrastructure. Thin-film lithium niobate (TFLN) photonic integrated circuits (PICs) have emerged as a new platform to offer a breakthrough—combining ultra-high performance such as 400G/lane with lower power consumption. However, scaling the manufacturing of this game-changing technology for high-volume production hasn’t happened yet. 
In this talk, Lightium's CEO, Dr. Amir Ghadimi, will explore the challenges and opportunities of the TFLN platform, from material processing to CMOS-compatible fabrication and Lightium's journey to set up a production-grade foundry for the TFLN platform in a 200mm commercial silicon line. Learn how cutting-edge advancements in production are paving the way for the next generation of high-speed, energy-efficient optical networks.
 

  • Pasfoto Amir H. Ghadimi
    Amir H. Ghadimi
    CEO & Co-Founder
    (Lightium)
 

From UV to IR: Al₂O₃ Waveguides and 3D Printed micro optics for a broad range of Applications

Al₂O₃ is an emerging waveguide platform offering ultra-low loss from UV to IR and high rare-earth ion solubility for high optical gain. This presentation will cover its fabrication and applications, including optical amplifiers, biosensors, and on-chip lasers. Furthermore, I will introduce the integration of 3D-printed micro-optics on this platform, which enables efficient broadband light coupling and unlocks a new level of system integration and performance.

  • Pasfoto Lantian Chang
    Lantian Chang
    Assistant Professor
    (University of Twente)
 

Novel materials reshaping integrated photonics: implications for packaging and co‑packaging

Novel photonic materials and heterogeneous integration enable new device functions but introduce packaging, thermal, mechanical, and testability challenges. This talk reviews materials-driven design and assembly trade-offs, shares lessons learned from our research and innovation projects, and outlines practical strategies to simplify packaging and enable reliable co‑packaged systems.

  • Pasfoto Milan Milosevic
    Milan Milosevic
    Director of Research & Innovation
    (PHIX)
 

Challenges of integrated photonics for Cold-atom based quantum technology

Cold atoms form the backbone of a rapidly expanding ecosystem of quantum technologies, spanning precision timekeeping, inertial navigation, gravitational sensing, quantum simulation, and quantum computing. However, the optical architectures required to trap, cool, and manipulate atoms remain large, sensitive, and poorly suited for scalable or field-deployable systems. Overcoming these limitations demands a fundamental rethinking of how light is generated, shaped, and delivered near atoms.

Integrated photonics offers a promising route toward compact, stable, and reconfigurable light–atom interfaces. Recent advances in ultra-low-loss platforms such as silicon nitride and glass-based waveguides open pathways toward chip-scale implementations of optical trapping and control. Yet translating photonic integration into the cold-atom domain introduces profound challenges, including multi-wavelength operation across the visible and near-infrared, vertical beam emission, sub-micron focusing, power handling, and ultra-high vacuum compatibility.

This talk reviews the current state of integrated approaches to cold-atom control and the critical requirements imposed by atom interferometry and neutral-atom quantum computing. Particular attention will be given to use cases—from spaceborne quantum sensors to autonomous navigation systems—where integrated platforms can enable scalable deployment. I will discuss key technological hurdles and outline emerging strategies for achieving fully integrated, robust cold-atom systems for sensing, timing, and quantum information processing.

  • Pasfoto Philippe Bouyer
    Philippe Bouyer
    Professor
    (TU Eindhoven)
 

Integrated photonics for scalable atomic systems

Photonic integration offers a powerful route to scalability in atomic platforms, opening the door to architectures far beyond what free-space optics can support. In addition to tailored beam delivery to large-scale 2D arrays without crosstalk, grating outcouplers can provide stable structured light fields for faster, higher-fidelity quantum operations, integrated fluorescence collection directly on chip, and even circularly polarized emission crucial for atomic state control. This talk will present recent progress on ion and neutral atom trap systems leveraging these technologies in the ultraviolet, visible, and infrared spectra simultaneously, and advancing their feasibility for deployment in scalable quantum computing applications.

  • Pasfoto Gillen Beck
    Gillen Beck
    Doctoral Student
    (ETH Zurich)
 

Hardware authentication for quantum communication

For secure communication you need authentication as much as you need encryption. This is usually achieved through asymmetric cryptography or pre-shared keys. An alternative approach involves the use of physical unclonable functions, essentially hardware based “fingerprint” keys. These provide authentication by direct quantum-secure readout of the hardware keys via standard optical communication infrastructure. QSA technology is developing PIC-based implementations of such optical PUFs.

  • Pasfoto Daan Stellinga
    Daan Stellinga
    CTO
    (QSA Technology BV)
 

Customized Photonic Integrated Circuits for Neuromorphic Photonics and Brain-Inspired Computing

Neuromorphic photonics provides a pathway to surpass the energy and bandwidth constraints of conventional electronics by leveraging the inherent parallelism and ultrafast behavior of light. Recent advances demonstrate how customized photonic integrated circuits (PICs) can be engineered to enable neuromorphic architectures. Tailored layouts are employed to replicate neural operations with high connectivity and minimal latency. Emphasis is placed on device–system co‑optimization, scalable fabrication strategies, and performance evaluation relative to electronic implementations. Fraunhofer IMS’s customized PIC platform thus supports flexible realization of photonic neurons and synapses, opening opportunities for next‑generation brain‑inspired information processing systems.

  • Pasfoto Anne Lena Schall - Giesecke
    Anne Lena Schall - Giesecke
    Professor
    (Fraunhofer IMS University of Duisburg)
 

Integrated Neuromorphic Photonics at TU/e’s Photonic Integration Group

Neuromorphic photonics is a rapidly evolving and promising field where the functionalities of biological neurons are mimicked using photonic integrated circuits. Developments in this field are driven by the demand for energy-efficient artificial intelligence (AI) accelerators. At the Photonic Integration Group, various approaches to developing AI accelerators are currently being researched. These range from integrated all-optical spiking laser neurons to opto-electronic computational nodes and vector-matrix multipliers using phase-change materials. In this talk, these various approaches will be addressed to showcase the developments in this exciting field.

  • Pasfoto Lukas Puts
    Lukas Puts
    Postdoctoral Researcher
    (Eindhoven University of Technology)
 

Sustainable PICs through Smarter Designs and Affordable Fast Prototyping

In this talk, I will present our group’s journey in developing photonic integrated circuits (PICs) with a focus on fast, cost-effective, and sustainable prototyping. We started with polymer-based devices, which allowed simple fabrication and rapid design iterations. Building on this foundation, we explored more advanced materials and complex device architectures, typically challenging to process. To enable fast iteration cycles, we developed in-house fabrication capabilities, including a direct laser writing platform. I will discuss how these approaches, combining material choice, innovative design, and accessible instrumentation, accelerate PIC development while reducing cost and environmental impact.

  • Pasfoto Imran Avci
    Imran Avci
    Assoc. Prof.
    (VU Amsterdam)
 

Nanophotonics for diagnostics in healthcare

I will describe recent developments at TU/e that exploit nanophotonics and photonic integration for diagnostics in healthcare. Nanophotonics provides unique opportunities to amplify the inherently weak signals of biomolecules thereby improving sensitivity and response time. I will describe the underlying nanophotonic detection principles and highlight applications in the area of point-of-care diagnostics and continuous monitoring biosensing. Finally, I will discuss the role that PICs can play in terms of miniaturization and broad deployment.

  • Pasfoto Peter Zijlstra
    Peter Zijlstra
    Professor
    (TU Eindhoven)
 

Towards sustainable photonic integrated circuits and systems

Photonic Integrated Circuits (PICs) are central to communication, mobility, artificial intelligence, and other emerging applications, offering high-speed, low-power, and compact solutions. Yet, PICs themselves are not inherently sustainable. This talk explores how system-level thinking—spanning circuit design, component trade-offs, integration, and packaging strategies—can guide more energy- and material-efficient photonic development. Drawing from imec’s experience in hybrid and heterogeneous photonic integration, I will highlight practical challenges and design choices in applications such as optical connectivity and mobile sensing. The goal is to encourage a sustainability mindset early in the design process, balancing performance, cost, and environmental impact.

  • Pasfoto Wenjing Tian
    Wenjing Tian
    Researcher
    (imec Netherlands)
 

Programmable Photonics in Thin Film Lithium Niobate

Thin film lithium niobate (TFLN) is an emerging integrated photonic platform with great potentials in various sectors including programmable photonics and computing. In this talk, I will focus on our recent works on linear on nonlinear programmable photonics in TFLN for applications in optical and radio-frequency (RF) photonic signal processing.   

  • Pasfoto David Marpaung
    David Marpaung
    Co-founder & Chief Scientist
    (Sabratha Photonics)