IPSR-I Autumn Meeting 2025

Date: 6 November 2025
Time: 8:30 - 17:00
Location: Evoluon, Eindhoven
 

This year, PIC Summit Europe will co-host the IPSR-I Autumn Meeting to create a shared industry vision for future product standards and fabrication methodologies to enable the full potential of integrated photonics. 

6 November: IPSR-I's core goal: Identifying core technological bottlenecks (PBW) in relevant markets for PICs for the next 6–15 years to impact relevant decision makers​.​ Autumn edition focus:​ Identifying market short- and long-term directions for navigating relevant decision makers on which bottlenecks to focus​.

Programme

8.30 Welcome and coffee
9.00 Plenary on the Roadmap 2026

 

9:15AM - Jupiter room​: PICs for AI Data Centers
Overcoming Connectivity Roadblocks with CPO architecture​

  • Yannick De Koninck - Senior Engineer, NVIDIA​
  • Vladimir Kozlov - CEO & Founder, Lightcounting​
  • Armand Pruijmboom – former Head of Product Engineering, TRUMPF Photonic Components GmbH​
  • Amir H. Ghadimi - CEO & Co-founder, Lightium​
  • Moderator: Alexey Kovsh - Chair of the board, Innolume​

Expect interesting discussions on the following topics:​

  • How can non-silicon photonic PIC technologies find their place in CPO architectures that are silicon-driven by design
    and philosophy?​
  • Densification as a key trend in AI clusters, does it push the industry away from optical scale-up fabrics?​
  • For Scale-Up optical fabrics, which will dominate - VCSELs or Silicon Photonics?​
  • Will CPO disrupt the current prosperous growth of optical transceiver companies, and what is the highest feasible bandwidth for pluggable LPO/LRO modules? ​

9:15AM - Neptune room​: PICs for Quantum Technologies: Barriers for adoption

  • Pramod Kumar - Director of Research & Innovation, QuantLase Research & Development Center​
  • Kiki Schuurman - R&D Engineer, QphoX​
  • Jin Chang - Research and Application Scientist, Single Quantum B.V.​
  • Martin Hauer - Manager Integrated Photonics, KEEQuant GmbH​
  • Moderator: Jelmer Renema, Assistant Professor of Twente University and Chief Scientist at QuiX Quantum. ​

We will touch hot topics for discussion:​

  • Scalability and Qubit Count: How many qubits are required for a truly useful quantum computer, and what applications will PICs unlock?​
  • Manufacturability and Integration: Can complex PIC circuits for quantum applications be produced at scale using advanced integration techniques such as micro-transfer printing or flip-chip assembly while maintaining
    performance and yield?​
  • Component and System Requirements: What technical breakthroughs in components: such as detectors, single photon sources, cooling methods, and ultra-low-loss materials, are needed to enable stable, high-fidelity quantum operations?

9:15AM - Saturn room​: PICs in Bio Sensing: Barriers for adoption​

  • Peter Harmsma - Researcher, Delta Life Science ​
  • Luc Scheres - CTO & co-founder, SurfiX​
  • Mickey Bryan - CEO, Phlotonics​
  • Elvira Paulussen - Senior Scientist, Philips​
  • Henk Stapert – CTO, Smartqare ​
  • Moderator: Natallia Uzunbajakava - Senior Scientist, TNO 

Moderator will touch upon such topics as:​

  • Market and Application Outlook: Drivers for early adoption (environment & agri-food wearables and consumer wellness, decentralized and point of care diagnostics, defense), success factors (volume potential, clinical evidence and regulatory pathway)​
  • Performance targets: limit of detection (LoD), limit of quantification (LoQ), dynamic range, time to result, multiplexing, robustness in biological matrices​
  • Functions impacting reliability and reproducibility:  sample preparation, surface biofunctionalization, fluidics integration, chip architecture (plasmonic, ring resonator, phase detection, etc.), light source, thermal & environmental drift​
  • Scalability, integration, miniaturization: cost-effective process flow and supply chain for wafer-level production at scale; integrating surface chemistry, fluidics, photonics, electronics;  methods for robustness, miniaturization, shrinking electronics for wearables;  wearables in biological matrices (e.g., sweat, interstitial fluid).​
10.30 Coffee break 

11:00AM - Jupiter room​: Densification for 12.8T Transceivers: Future Roadblocks in PIC-Based Pluggables​

  • Jeffrey Lee - COO, CubiQ​
  • Roy Rubenstein - Publisher/Journalist, GazettaByte​
  • Philippe Bolle - CEO, Estel​
  • Antonio Teixeira - CSTO, PICadvanced​
  • Moderator: Alan Evans - Chair of Industrial Advisory Board, MIT’s Microphotonics Center

Moderator will touch upon the following key directions with the panellists:​

  • Bandwidth Scaling: OSFP and QSFP-DD modules are nearing physical and thermal limits, with future bandwidth gains relying on advances in modulation, wavelength integration, and electrical I/O density.​
  • Architecture Shift: Coherent optics and Linear Pluggable Optics (LPO) will define the next data center transition, driven by reach, power efficiency, and SERDES capability at 200G lanes.​
  • Power and Cooling: Energy efficiency and thermal management are becoming decisive factors, with liquid cooling and co-integration delaying but not eliminating the move toward co-packaged optics.​
  • Market Expansion: Integrated photonic pluggables can extend beyond data centers into 5G and DCI markets, driving scale, cost efficiency, and broader photonic adoption.

11:00AM - Neptune room​: PICs for LiDAR: Barriers for adoption

  • Remus Nicolaescu - Managing Director, Pointcloud​
  • Grégory Pandraud - Vice President Research, Ommatidia​
  • Marcus Dahlem - Program Manager for Optical 3D Sensing, imec​
  • Chris Phare - Co-founder, Chief Science Officer, Voyant Photonics
  • Moderator: Carol de Vries - Chief Strategy and Startup support, Photondelta

Moderator will guide you through:​

  • PIC Roadblocks for LiDAR: Current adoption of photonic integrated circuits in LiDAR is constrained by challenges in price points for different applications, performance and barriers to volume like reproducibility, reliability, cost, and
    performance consistency at both system and component levels.​
  • LiDAR Architecture Choices: Competing approaches: FMCW versus ToF or Flash, from fully integrated PIC designs to hybrid opto-mechanical and FPA/OPA architectures, differ in complexity, scalability, and suitability for emerging market requirements.​
  • Component Performance Needs: Advancements in key components such as lasers, modulators, and detectors are critical to meeting the precision, range, and cost targets for next-generation LiDAR systems.​
  • Market Outlook: Diverse applications across automotive, drone, industrial, robotics and consumer markets will drive distinct volume and pricing dynamics, shaping the pace and direction of PIC-enabled LiDAR adoption.​

11:00AM - Saturn room​: PICs in Spectral Sensing: Barriers for adoption​

  • Thijs van Leest - Director R&D, PhotonFirst​
  • Martijn de Bruin – Professor in Biomedical Engineering, AUMC​
  • Gunay Yurtsever - Senior Researcher, imec​
  • Moderator: Ton van Leeuwen - Professor in Biomedical Physics, AUMC​

During this session the following aspects will be discussed:​

  • Integration and Performance: How can photonic integrated circuits enable compact, high-resolution spectral sensing systems such as OCT, FBG, and gas analyzers while maintaining precision and dynamic range?​
  • Manufacturability and Scalability: Can PIC-based spectral sensors be manufactured reliably and cost-effectively at scale, leveraging integration methods like micro-transfer printing or hybrid assembly?​
  • Component and System Needs: What advances in on-chip light sources, filters, detectors, and low-loss waveguides are required to achieve the necessary sensitivity, stability, and wavelength accuracy?​
  • Market and Application Outlook: Which sectors: medical imaging, industrial monitoring, environmental sensing, or safety systems will drive early adoption of PIC-based spectral sensing, and what performance-to-cost benchmarks will determine market traction?​

12.15 Panel closing (Moderators panel to present key takeaways and discussion)
12.45 Lunch
13.30 Side events: 

  • PhotonixFAB workshop: Accelerating PIC Innovation: From Idea to Market Applications. For more information & registration: click here.

  • 50 years InP epitaxy symposium 2025: for more information & registration: click here

     

The International Integrated Photonics Systems Roadmap 

The goal of the IPSR-I is to establish and sustain a trust-based global network of industrial, and research and development partners working together to define the future of Photonic Integrated Circuits (PICs). It’s a joint initiative between PhotonDelta in Europe and the Microphotonics Center at MIT in the United States. So far, more than 400 experts have contributed to the roadmap. 

Together, the IPSR-I network will enable the fastest possible scaling of integrated photonics for applications by delivering an up-to-date technology roadmap driven by market needs. The roadmap meetings are a unique opportunity to get everyone around the same table to discuss the way forward, bridging the gaps between industry and academia, markets and technologies, as well as electronics and photonics. 

 

How to join? 

Active IPSR-I members 

Active members of the IPSR-I community will receive an email inviting them to the autumn meeting at PIC Summit Europe in Eindhoven. You can also register below for a free ticket for the IPSR-I meeting on 6 November, or combine the meeting with a visit to PIC Summit Europe on 4-5 November. 

Unfortunately all spots for the IPSR-I Autumn Meeting 2025 are completely full. It is no longer possible to register for IPSR-I. 

Are you an expert in photonics or electronics and interested in getting involved? 

A call is always open for contributions by experts in the various technological and applicational fields to update the IPSR-I. The Integrated Photonic Systems Roadmap International (IPSR-I) invites all organizations, including universities, research institutes, SMEs, customers, and the vertical supply chain, to participate.  

The IPSR-I is a living document that is continuously updated. The chapters need enrichment with technological, module, and application developments in their respective fields. Throughout the years, the working groups work together on updating their respective roadmap chapters, and twice a year, a physical meeting is organized to get together. 

Participation and attendance at all physical IPSR-I meetings are by invitation, but all stakeholders who are willing to devote time and effort to achieve the goals of IPSR-I are encouraged to participate. 

To join the IPSR-I community, please contact Vadim Pogoretsky the IPSR-I Roadmap Director & Technical Project Manager, via Vadim@photondelta.com.